Samsung has collaborated with Ansys to certify RedHawk-SC Electrothermal for simulating temperature profiles with their packaging technology. A single die can draw well over 100W of power which must be routed through extremely fine microbump connections. The dense integration of multiple chips creates a major challenge in heat dissipation. Samsung offers a range of 2.5D packaging options ( I-Cube and H-Cube) as well as 3D vertical stacking with X-Cube technology. Many leading semiconductor products for high-performance computing, smartphones, networking, artificial intelligence, and graphics processing are made possible by 3D-IC technologies, which can also help companies achieve competitive differentiation in their markets.
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